Challenge: Dissipating Heat from Microelectronic Devices
Microelectronic devices generate heat during normal operation. Because excess heat impairs performance and can lead to device failure, thermal management is a top priority. Kyocera offers a broad line of packaging materials that feature high thermal conductivity to ensure the optimal package material for your performance requirements.
Thermally Conductive Ceramics
Thermal Conductivity of Ceramic Materials
Ceramics exhibit higher thermal conductivity than organic materials, making them ideal for applications requiring better thermal dissipation and higher reliability.
*Values above may vary with material changes or process improvement
Kyocera recommends the optimal ceramic materials tailored to your requirements (see details in the Material Properties Table below). Thermal simulations are available upon request.
Simulation Results by Material
Selecting a substrate with high thermal conductivity is the first step in managing heat generated by microelectronic devices.
See simulation below.
Simplified formula for calculating thermal resistance.
