Ceramic Substrates and Packages for Automotive LEDs

Features

Higher Thermal Dissipation

IATF 16949 Certified

Various Thin Film Options
For High-Reliability, High-Current Applications

Design Flexibility for Cavity Structures
Easy Resin Potting

Our packages and substrates are IATF16949 certified with a proven track record of supporting automotive applications.

*IATF16949: An international standard for quality management systems in the automotive industry, developed by the International Automotive Task Force.

Single-Layer Substrate + Thin Film

A sample of Aluminum thin film process

• Kyocera tailors film configurations to meet customer requirements. For example, the aluminum thin film process is available for Al wire-bonding requirements.
  Check other available film configuration options here.
• For traceability, each piece can be serialized with laser marking.

Multilayer Substrate + Thin Film

• Thin-film processing is available on the surface of multilayer substrates
• High-density, 3-D electrical routing is possible with a multilayer ceramic structure

Surface-Mount Multilayer Packages

Structure / Concept (Alumina / Aluminum Nitride)

Round Cavity

Square Cavity

Hermetic Sealing

Stepped Structure for Lid Placement

(Cross-Section)
Easy lid placement for sealing

Angled Cavity

(Cross-Section)
Cavity walls serve as reflectors.

With Heat Spreader

(Cross-Section)
Cu fittings optimaize heat dissipation. (Alumina Only)